High-temperature superconductivity is still not fully understood. Now, an international research team at BESSY II has ...
Abstract: Wafer-to-wafer hybrid bonding technology is a key enabler to achieve fine-pitch 3D integration, allowing shorter electrical paths, lowest signal loss, higher performances, and increased ...
New analysis shows how copper ions and microclimate combined to preserve a 12-year-old’s remains in vivid green for more than ...
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