TOKYO--(BUSINESS WIRE)--Kioxia Corporation, a world leader in memory solutions, today announced the development of highly stackable oxide-semiconductor channel transistors that will enable the ...

When natural disaster strikes, a building’s survival often depends on how it’s built. Engineers at Carnegie Mellon University have created a fast, highly accurate simulator for spray-based concrete 3D ...

The semiconductor industry is at a pivotal moment as the limits of Moore’s Law motivate a transition to three-dimensional integrated circuit (3D IC) technology. By vertically integrating multiple ...

Experts at the Table: Semiconductor Engineering sat down to discuss 3D-IC design challenges and the impact on stacked die on EDA tools and methodologies, with John Ferguson, senior director of product ...

Experts at the Table: Semiconductor Engineering sat down to discuss initial forays into 3D-ICs and what problems early adopters will encounter, with John Ferguson, senior director of product ...

Sungrow has unveiled two groundbreaking products during a PV&ESS summit in Dubai, with over 300 partners and industry experts witnessing the launch of the 1+X 2.0 modular inverter and PowerTitan 3.0 ...

Inter-Die Gapfill Tool Expands Industry-Leading Portfolio of Solutions for 3D Integration and Chiplet Technologies; Paves Way for New, AI-Accelerating Architectures Addresses Manufacturing Pain ...

Monolithic integration has been the dominant approach to chip design since the rise of VLSI-based ASICs decades ago. In a monolithic design, all of the building blocks of integrated circuits such as ...

Yangtze Memory Technologies Co. (YMTC), China's top NAND flash maker, is advancing its push for equipment self-sufficiency. Supply chain sources say the company's first NAND production line built ...

TL;DR: Huawei is set to lead Apple by integrating high-performance HBM DRAM with 3D stacking technology in smartphones, boosting AI efficiency and bandwidth while reducing chip size. Apple plans to ...