A semiconductor manufacturing company has little control over the system in which its parts are used. However, the system in which the IC is mounted is critical to overall device performance. For ...

Sigrity Inc this week introduced OrbitIO Planner, a tool for dynamic I/O planning across IC, package, and PCB (printed-circuit-board) design. To date, the company has offered tools for IC, package and ...

Dublin, June 23, 2023 (GLOBE NEWSWIRE) -- The "IC Substrate in the Global PCB Market: Trends, Opportunities and Competitive Analysis 2023-2028" report has been added to ResearchAndMarkets.com's ...

Mentor Graphics is bringing together the IC design, package design and PCB layout in a single tool environment. The design environment called Xpedition Package Integrator flow can be used to integrate ...

New York, June 13, 2023 (GLOBE NEWSWIRE) -- Reportlinker.com announces the release of the report "IC Substrate in the Global PCB Market: Trends, Opportunities and ...

IC packaging is a technique for shielding semiconductor equipment from ambient physical damage or degradation by wrapping them in ceramics or polymer packaging materials. There are several varieties ...

Historically IC package design has been a relatively simple task which allowed the die bumps to be fanned out on a package substrate to a floorplan geometry suitable for connecting to a printed ...

US firm Reflex Photonics says that its new product line is perfect for ultrashort reach optical interconnects to and between IC packages on a single PCB. Reflex Photonics, the US developer of ...

Printed-circuit-board (PCB) substrate material, like FR-4 glass epoxy, is a poor conductor of heat. Conversely, copper is an excellent conductor of heat. So, more copper area on a PCB is ideal from a ...

You’re probably familiar with the little black boxes nestled neatly inside your favorite devices. With their diminutive size and unassuming characteristics, it can be hard to believe these vessels are ...

Packing more IC functionality into smaller form factors stacks the deck against IC makers and foreshadows difficult interconnect challenges. How much can one package take? As consumer electronics ...