HORSHAM, PA--(Marketwired - Jul 8, 2013) - Today at SEMICON West, Solid State Equipment LLC (DBA SSEC), a leading provider of single wafer wet processing systems used in the manufacture of ...
NexGen Wafer Systems is excited to announce the launch of SERENO, its latest multi-chamber platform designed for Wet Etch and Clean applications. SERENO combines high performance with exceptional ...
Through silicon via (TSV) technology is a key design element being incorporated into more and more advanced packaging designs today. TSVs offer distinct benefits in form factor and improved ...
In circuitry, etching is used to remove the deformed layer created during the grinding and polishing of metal components by selective chemical attack. Now, a research group at Nagoya University in ...
San Jose, Calif. – October 5, 2009 — Novellus Systems (NASDAQ: NVLS) today announced that it has developed a manufacturing process to extend the company's SPEED Max shallow trench isolation (STI) ...
Applied Materials has come up with a new etch technology capable of a precision of two atomic layers. The system, called Selectra, is already installed in 10nm process flows at five customers – three ...
(Nanowerk News) Bulk FinFETs are key devices for advanced technology node applications such as analog circuits and SRAMs because of a very good short channel effect control and transistor compactness.
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