Modern semiconductor manufacturing technology has advanced rapidly. Because of this, measurement using non-contact displacement and transparent coating thickness has become very critical. Applications ...
In the last few years, semiconductor circuit features have shrunk to sub-100 nanometer (nm) dimensions, while the size of the thin silicon wafers that these circuits are constructed on has grown from ...
Let us help you with your inquiries, brochures and pricing requirements Request A Quote Download PDF Copy Download Brochure MTI Instruments offers Proforma 300SA, a ...
LOWELL, Mass., June 12, 2014 /PRNewswire/ -- MicroSense, LLC, a leader in non-contact wafer metrology systems, today announced multiple shipments of its new, next-generation automated sapphire wafer ...
The big picture: Infineon has developed the world's thinnest silicon power wafers, measuring just 20 micrometers in thickness – about the same as a human hair. These wafers promise significant ...
A new instrument under development at the US National Institute of Standards and Technology uses infrared laser light to precisely measure the thickness of 300 millimetre silicon wafers. In the last ...
MILPITAS, Calif.--(BUSINESS WIRE)--KLA-Tencor (NASDAQ: KLAC) today released its next-generation in-situ plasma etch wafer temperature measurement product, the EtchTemp SensorWafer™. The newest ...
Building semiconductors is an incredibly exacting process, with critical dimensions posing significant equipment challenges – and with the possibility that small process excursions can cause the yield ...
Semiconductor devices are becoming thinner and more complex, making thin deposited films even harder to measure and control. With 3nm node devices in production and 2nm nodes ramping toward ...
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