SiC Wafer Processing Market Expansion Accelerates, Projected to Reach US$ 2,986.44 Million by 2032

The global SiC Wafer Processing market size is projected to reach US$ 2,986.44 million by 2032, at a CAGR of 14.43% ...

Future Leading SiSiC/RBSIC Cantilever Paddles: Lightweight Strength for Continuous Kilns

In the center of this technological transition, Future Leading SiSiC/RBSIC/silcon carbide Cantilever Paddle products are emerging as a key solution for stable wafer handling and continuous kiln ...
Mena FN

Thin Wafer Processing And Dicing Equipment Market Projected Expansion To $1.2+ Bn Market Value By 2031 With A 6.7% CAGR

(MENAFN- EIN Presswire) Rest of Asia-Pacific segment contributed the major share in the thin wafer processing and dicing equipment market in 2021. The thin wafer processing and dicing equipment market ...
Business Insider

The global thin wafer processing and dicing equipment market was valued at USD 536.71 million in 2019 and is estimated to register a CAGR of 6.44% over the forecast period (2020

New York, Feb. 21, 2020 (GLOBE NEWSWIRE) -- Reportlinker.com announces the release of the report "Thin Wafer Processing and Dicing Equipment Market - Growth, Trends ...
EDN

Single-wafer processing to affect supply chain

The inevitable move to one-at-a-time wafer processing, expected to come about in the 300mm-wafer generation, is almost certain to have a dramatic impact on the manufacturing supply chain, according to ...
EDN

X-Fab Begins SOI Wafer Processing

X-Fab Semiconductor Foundries today announced it has expanded its product line, entering the silicon on insulator (SOI) wafer processing arena. The Erfurt, Germany-based mixed-signal foundry has ...
Yahoo Finance

Xanadu and DISCO announce collaboration on advanced wafer processing for photonic quantum computing

TORONTO, Aug. 12, 2025 /PRNewswire/ - Xanadu, the leading photonic quantum computing company, and DISCO Corporation, renowned precision machine and processing tool manufacturer, are developing ...
Nasdaq

ACM Research Launches Its First Plating Tool to Support Wafer-Level Packaging and Plating Applications in Compound Semiconductor Manufacturing

FREMONT, Calif., Aug. 25, 2021 (GLOBE NEWSWIRE) -- ACM Research, Inc. (ACM) (NASDAQ: ACMR), a leading supplier of wafer processing solutions for semiconductor and advanced wafer-level packaging (WLP) ...
Digi Times

PSI rules out China for new wafer processing fab site

Taiwan-based Phoenix Silicon International (PSI), dedicated to wafer reclaim, wafer thinning and MEMS mid-end process services, plans to set up a new plant to fulfill robust orders from international ...
SiliconANGLE

Graphcore debuts 3D AI chip with new wafer-on-wafer technology

Chip startup Graphcore Ltd. today introduced a new artificial intelligence processor, the Bow IPU, that uses an innovation dubbed wafer-on-wafer technology to speed up calculations. U.K.-based ...
VentureBeat

Cerebras’ wafer-size chip is 10,000 times faster than a GPU

Cerebras Systems and the federal Department of Energy’s National Energy Technology Laboratory today announced that the company’s CS-1 system is more than 10,000 times faster than a graphics processing ...