Higher density and more vertical layers require higher-resolution inspection. In the past that generally resulted in longer scan times, which can slow throughput in the fab or assembly house. Bryan ...

Some industry sectors such as automotive and medical continue to push for higher and higher reliability levels; however, many fabs are having difficulties achieving them. Current inspection regimes ...

Hybrid bonding—a significant advancement in chip packaging technology—is becoming vital in heterogeneous integration, which enables semiconductor companies to merge multiple chiplets with diverse ...

“Wafer mass metrology has become increasingly important as semiconductor processes have become more complex and sensitive,” said Microtronic CEO Reiner Fenske in making the announcement. “Today’s fabs ...

This article describes a six-inch wafer inspection microscope that provides automated, reproducible differential interference contrast (DIC) imaging, regardless of the user’s skill level. Wafer ...

Following its acquisition of Candela Instruments, KLA-Tencor (www.kla-tencor.com) has introduced the Candela CS20, an automated wafer inspection system designed to address the defect management ...