A laser-induced thermocompression bonding technique developed by researchers at Wuhan University enables the bonding of Cu nanowires with a diameter of 200 nm to Au pads. Published in the ...

GRENOBLE, FRANCE: At the SEMI European 3D TSV Summit, world-leading nanoelectronics research center imec and Besi, a global equipment supplier for the semiconductor and electronics industries, ...

A new member to ficonTEC's portfolio is the thermocompression die bonder BL500-M. High forces of up to 800 N in combination with a heating process and a split optic make it possible to bond large dies ...

Imec and Besi have developed an automated thermocompression solution for narrow-pitch die-to-wafer bonding, a method by which singulated dies are stacked onto bottom dies which are still part of a ...

The Nature Index 2025 Research Leaders — previously known as Annual Tables — reveal the leading institutions and countries/territories in the natural and health sciences, according to their output in ...

The most advanced makers of semiconductor packages use plasma to improve yield and reliability, especially when using advanced materials and package sizes decrease. Chip manufacturers rely on plasma ...