Emil Otto is aiming at joining steel, stainless steel, brass and copper objects below 450°C with three tin-based soft-soldering pastes. “The soldering and tinning pastes do not require zinc chloride, ...

Molded for lead-free process requirements, Multicore LF328 is a halide-free, no-clean, lead-free solder paste suitable for high-volume, stencil-printing applications with chip-scale-package lead ...

The printed circuit board assembly process has undergone revolutionary changes over the past three decades. What once relied ...

The result is that the entire board is much denser, and comments can be installed on both sides of the PC board, as seen in Figure 2 . Since the board does not require drilling for component leads ...

With improvements in technology enhancing people’s lives, electronic products requirements have become greater in terms of being lighter, thinner, smaller, higher performance, and having more ...

Through-hole chips are slowly falling by the wayside, and if you want to build something with new parts you will be using surface mount components. This means spreading paste and throwing it in the ...

When doing surface-mount assembly you can certainly use a soldering iron in the traditional way, but it’s far more convenient to cover the pads with solder paste, place the components, and bake the ...