Why should there be an interest in Package Assembly Design Kits (PADK) today? For the most part, it is due to the advancement in the accumulation of files forming the PADK now offering a customized ...

The Ball Grid Array, or BGA package is no longer the exclusive preserve of large, complex chips on computer motherboards: today even simple microcontrollers are available with those little solder ...

Researchers at Pohang University of Science and Technology (POSTECH) have developed an artificial intelligence approach that ...

As system-on-chip designs migrate to nanometer silicon, packaging technology is challenged to keep pace with the integration and performance capabilities offered. Nowhere is this more so than in ...

Mentor Graphics is bringing together the IC design, package design and PCB layout in a single tool environment. The design environment called Xpedition Package Integrator flow can be used to integrate ...

For many applications, next generation IC packaging is the best path to achieve silicon scaling, functional density, and heterogeneous integration while reducing the overall package size.

Abstract: This application note discusses ways to help system designers apply proper layout techniques and signal routing. The layout and component descriptions will minimize noise pick-up and manage ...

In today’s ever-shrinking IC package design cycles, it is almost imperative that we catch and correct routing issues as early as possible, which makes simulation an integral part of the design cycle.