A report titled “Manufacturing Roadmap for Heterogeneous Integration and Electronics Packaging (MRHIEP)” was published by researchers at SEMI and the University of California Los Angeles (UCLA)’s ...
The terms “chiplet” and “heterogeneous integration” fill news pages, conference papers, and marketing presentations, and for the most part engineers understand what they’re reading. But speakers ...
Digital lithography technology (DLT) is promising chipmakers to combine chips with submicron wiring on glass and other large substrates. And this maskless technology is at the center of a strategic ...
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