Forbes contributors publish independent expert analyses and insights. Marco Chiappetta is a technologist who covers semiconductors and AI. Cadence Design Systems made a major advancement with it ...

The semiconductor industry is moving out of the monolithic age of the system-on-chip (SoC). Instead of arranging every building block of IP on the same slab of silicon, the movers and shakers in the ...

There’s currently a significant buzz within the semiconductor industry around chiplets, bare silicon dies intended to be combined with others into a single packaged device. Companies are beginning to ...

The world is experiencing an insatiable and rapidly growing demand for artificial intelligence (AI) and high-performance computing (HPC) applications. Breakthroughs in machine learning, data analytics ...

Silicon Catalyst COO Nick Kepler will deliver a special presentation, “Catalyzing Chiplet Startups,” on Wednesday, February 18, at 11:20 am. On Thursday, February 19, from 3:00-4:20 pm, Silicon ...

Introduces support for the latest interconnect standards, including Universal Chiplet Interconnect Express™ (UCIe™) 2.0 and Open Compute Project Bunch of Wires (BoW). Enhances Keysight’s EDA standards ...

TL;DR: AMD's new multi-chiplet gaming GPU patent introduces a "smart switch" to reduce latency and optimize memory access, potentially overcoming monolithic design limits. This innovation, inspired by ...

As chiplet-based architectures transform advanced semiconductor design, security becomes a core enabler of performance, scalability, and interoperability. The Third Annual Chiplet Summit brings ...

The move to multi-die integration brings both promise and complexity. Scalable interconnects and automation are emerging as key enablers of future designs. Where chiplets stand today and what’s ...

A technical paper titled “Floorplet: Performance-aware Floorplan Framework for Chiplet Integration” was published by researchers at Chinese University of Hong Kong and University of California ...