MILPITAS, Calif. — LSI Logic Corp. here today unveiled its third-generation of organic flip-chip packages, called flxI/O, which uses an area array approach for signal I/O placement to optimize die ...
SEOUL, South Korea--(BUSINESS WIRE)--Samsung Electronics Co., Ltd., a world leader in advanced component solutions, today introduced a new lineup of flip chip LED packages and modules offering ...
Flip-chip is hot, and so are licensing and other development deals tied to the space-saving semiconductor packaging technology, which is seeing growing use in portable and other sophisticated ...
CHANDLER, Ariz., Oct. 17, 2024 (GLOBE NEWSWIRE) -- Satisfying mission assurance requirements for the most critical space programs, Microchip Technology’s (Nasdaq: MCHP) Radiation-Tolerant (RT) RTG4™ ...
Placing multiple chips into a package side-by-side can alleviate thermal issues, but as companies dive further into die stacking and denser packaging to boost performance and reduce power, they are ...
Karl J. Puttlitz Sr. and Paul A. Totta have won the 2008 IEEE Components, Packaging and Manufacturing Technology Award. They are being recognized for their pioneering role in the establishment of flip ...
Not so long ago, defense and aerospace applications were the traditional drivers of advances in electronic packaging technologies, or "the way electronic systems are assembled." At the time, cost was ...
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