SANTA CLARA, Calif. — New generations of higher density, smaller stacked multichip packages (MCP) are needed to meet the exploding memory needs of servers, switches and routers, and new high speed ...

The stack of memory chips holds 16GB of memory and takes up the same amount of space formerly required for one chip. Michael Kanellos is editor at large at CNET News.com, where he covers hardware, ...

Packaging houses are readying their next-generation advanced IC packages, paving the way toward new and innovative system-level chip designs. It’s a confusing landscape with a plethora of buzzwords ...

Intel disclosed several chip packaging breakthroughs at the Electronic Components Technology Conference (ECTC), outlining the technical merits of multiple new chip packaging techniques. We spoke with ...

Chipmakers, OSATs and R&D organizations are developing the next wave of fan-out packages for a range of applications, but sorting out the new options and finding the right solution is proving to be a ...

SEM (scanning electron microscope) images of test chip designed by Deca. Upper left show a molded multi-chip fan-out package with close-ups of the embedded die right and below The last time I wrote ...

Toshiba has unveiled a chip package for cell phones that can hold up to nine chips, which the company says will give manufacturers greater flexibility when building handhelds. The multichip package ...

Members can download this article in PDF format. Today, advances in semiconductors and ICs are producing ever smaller and denser circuits. With that comes the challenge of efficiently packaging and ...

In the never-ending quest to make cell phones and MP3 players smaller, Samsung Electronics has come up with a package that can stack 16 memory chips into a space that used to accommodate just one.