EDN

GHz-rate BGA sockets mimic IC footprint

Ironwood Electronics' SG-BGA-6000 family of gigahertz-rate BGA sockets offers zero-insertion-force (ZIF) performance for preproduction systems without sacrificing board real estate or device ...
New Electronics

Users can socket their BGA IC's with socket whose footprint same as IC footprint

BGA socket adapter provide an inexpensive and reliable interconnect for attaching BGA chips to target board. These adapters have less than half of the insertion force of competitive adapters, shorter ...
EDN

200-ball BGA socket has same footprint as IC

The Giga-snap SFS-BGA200B-52 socket allows an 11 x 14.5-mm, 200-ball BGA IC with a 0.65-mm pitch, 12 x 22-array to be placed in a socket with the same footprint as the IC to avoid compromising ...
Electronic Design

BGA Socket Supports JEDEC MO-207 ICs

Accommodating IC packages such as the JEDEC MO-207 BGA with a 0.8 mm pitch and 21 x 9 arrays with up to 189 balls, the SG-BGA-6103 BGA socket exhibits a 6.5 GHz bandwidth and supports dense BGA ...
Electronic Design

TDR Detects Defects In BGA Packages

TDA Systems Inc. of Portland, Ore., is developing a time domain reflectometry (TDR) software prototype for detecting defects in ball-grid-array (BGA) IC packages. TDR measurement is recognized as an ...